View MIC24051_8705197.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

? 2016 microchip technology inc. ds20005658a-page 1 MIC24051 features ? hyper speed control ? architecture enables: - high delta v operation (v in = 19v and v out = 0.8v) - small output capacitance ? 4.5v to 19v voltage input ? 6a output current capability, up to 95% efficiency ? adjustable output from 0.8v to 5.5v ? 1% feedback accuracy ? any capacitor stable - zero-to-high esr ? 600 khz switching frequency ? no external compensation ? power good (pg) output ? foldback current-limit and ?hiccup mode? short-circuit protection ? supports safe start-up into a pre-biased load ? ?40c to +125c junction temperature range ? available in a 28-pin 5 mm x 6 mm qfn package applications ? servers and workstations ? routers, switches, and telecom equipment ? base stations general description the MIC24051 is a constant-frequency, synchronous buck regulator featuring a unique adaptive on-time control architecture. the MIC24051 operates over an input supply range of 4.5v to 19v and provides a regulated output of up to 6a of output current. the output voltage is adjustable down to 0.8v with a guaranteed accuracy of 1%, and the device operates at a switching frequency of 600 khz. microchip?s hyper speed control ? architecture allows for ultra-fast transient response while reducing the output capacitance and also makes (high v in )/(low v out ) operation possible. this adaptive t on ripple control architecture combines the advantages of fixed-frequency operation and fast transient response in a single device. the MIC24051 offers a full suite of protection features to ensure protection of the ic during fault conditions. these include undervoltage lockout to ensure proper operation under power-sag conditions, internal soft-start to reduce inru sh current, foldback current limit, ?hiccup mode? short-circuit protection and thermal shutdown. an open-drain power good (pg) pin is provided. the 6a hyperlight load ? part, mic24052, is also available on microchip?s web site. typical application schematic MIC24051 28-p in qfn 10k 2.2f pg v in 4.5v to 19v 4.7f x2 en 0.1f 2.2h 0.1f 19.6k 2.49k 4.7nf 2.00k v out 1.8v/6a 100f MIC24051 vdd sgnd pg vin pvin pgnd en bst sw cs fb 10k pvdd 12v, 6a high-efficie ncy buck regulator with hyper speed control ?
MIC24051 ds20005658a-page 2 ? 2016 microchip technology inc. package type block diagram MIC24051 28-pin qfn (jl) (top view) pvin sw sw sw sw pvin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 24 23 22 21 20 19 18 17 28 27 26 25 cs pgnd bst pvin pvin pvin pvin pvin pvdd pgnd nc sw pgnd pgnd pgnd pgnd fb pg en vin vdd sgnd pgnd sw pvin r1 2.49k r2 2.00k 0.1f 19.6k 2.2f v out 1.8v/6a 2.2h 100f MIC24051 4.7nf 0.1f c bst bst sw fb vdd en pgnd vin pvin v in 4.5v to 19v 4.7f x2 g m ea comp cs cl and zc detection control logic timer soft-start fixed t on estimate uvlo ldo thermal shutdown soft start pvdd v ref 0.8v compensation sgnd d1 modified t off pg 10k vdd vdd 8% 92% 10k v in hsd lsd internal ripple injection pvdd
? 2016 microchip technology inc. ds20005658a-page 3 MIC24051 1.0 electrical characteristics absolute maximum ratings ? pv in to pgnd ....................................................................................................................... ..................... ?0.3v to +29v v in to pgnd ....................................................................................................................... ........................ ?0.3v to pv in pv dd , v dd to pgnd ....................................................................................................................... ............. ?0.3v to +6v v sw , v cs to pgnd ....................................................................................................................... ?0.3v to (pv in + 0.3v) v bst to v sw ............................................................................................................................... .................. ?0.3v to +6v v bst to pgnd....................................................................................................................... ..................... ?0.3v to +35v v fb , v pg to pgnd ....................................................................................................................... .. ?0.3v to (v dd + 0.3v) v en to pgnd ....................................................................................................................... ............?0.3v to (v in + 0.3v) pgnd to sgnd ................................................................................................................... ..................... ?0.3v to +0.3v esd rating ( note 1 ) .............................................................................................................................. .... esd sensitive operating ratings ? supply voltage (pv in , v in )......................................................................................................................... +4.5v to +19v pv dd , v dd supply voltage (pv dd , v dd )................................................................................................... +4.5v to +5.5v enable input (v en ) .............................................................................................................................. ................0v to v in ? notice: stresses above those listed under ?absolute maximu m ratings? may cause permanent damage to the device. this is a stress rating only and functiona l operation of the device at those or an y other conditions above those indicated in the operational sections of this s pecification is not intended. exposure to maximum rating conditions for extended periods may affect device reliability. ? notice: the device is not guaranteed to function outside its operating ratings. note 1: devices are esd sensitive. handling precau tions recommended. human body model, 1.5 k ? in series with 100 pf.
MIC24051 ds20005658a-page 4 ? 2016 microchip technology inc. table 1-1: electrical characteristics electrical characteristics: pv in = v in = v en = 12v, v bst ? v sw = 5v; t a = 25c, unless noted. bold values indicate ?40c t j +125c. ( note 1 ) . parameters sym. min. typ. max. units conditions power supply input input voltage range (v in , pv in )? 4.5 ? 19 v? quiescent supply current ? ? 730 1500 a v fb = 1.5v (non-switching) shutdown supply current ? ? 5 10 a v en = 0v v dd supply voltage v dd output voltage ? 4.8 5 5.4 vv in = 7v to 19v, i dd = 40 ma v dd uvlo threshold ? 3.7 4.2 4.5 vv dd rising v dd uvlo hysteresis ? 400 mv ? dropout voltage (v in ? v dd )? 380600mvi dd = 25 ma dc/dc controller output-voltage adjust range (v out ) ?0.8? 5.5 v? reference feedback reference voltage ? 0.792 0.8 0.808 v0c t j +85c (1.0%) ? 0.788 0.8 0.812 v ?40c t j +125c (1.5%) load regulation ? ? 0.25 ? % i out = 0a to 6a (continuous mode) line regulation ? ? 0.25 ? % v in = 4.5v to 19v fb bias current ? ? 50 500 na v fb = 0.8v enable control en logic level high ? 1.8 ?? v ? en logic level low ? ? ? 0.6 v ? en bias current ? ? 6 30 a v en = 12v oscillator switching frequency ( note 2 )? 450 600 750 khz v out = 2.5v maximum duty cycle ( note 3 )??82?% v fb = 0v minimum duty cycle ? ? 0 ? % v fb = 1.0v minimum off-time ? ? 300 ? ns ? soft-start soft-start time ? ? 3 ? ms ? short-circuit protection peak inductor current-limit threshold ? 7.5 11 17 a v fb = 0.8v, t j = 25c 6.6 11 17 v fb = 0.8v, t j = 125c short-circuit current ? ? 8 ? a v fb = 0v internal fets note 1: specification for packaged product only. 2: measured in test mode. 3: the maximum duty-cycle is limited by the fixed mandatory off-time (t off ) of typically 300 ns.
? 2016 microchip technology inc. ds20005658a-page 5 MIC24051 top mosfet r ds(on) ??42?m ? i sw = 1a bottom mosfet r ds(on) ??12.5?m ? i sw = 1a sw leakage current ? ? ? 60 a v en = 0v v in leakage current ? ? ? 25 a v en = 0v power good (pg) pg threshold voltage ? 85 92 95 %v out sweep v fb from low to high pg hysteresis ? ? 5.5 ? %v out sweep v fb from high to low pg delay time ? ? 100 ? s sweep v fb from low to high pg low voltage ? ? 70 200 mv sweep v fb < 0.9 x v nom , i pg = 1 ma thermal protection overtemperature shutdown ? ? 160 ? c t j rising overtemperature shutdown hysteresis ??15?c ? table 1-1: electrical characteristics (continued) electrical characteristics: pv in = v in = v en = 12v, v bst ? v sw = 5v; t a = 25c, unless noted. bold values indicate ?40c t j +125c. ( note 1 ) . parameters sym. min. ty p. max. units conditions note 1: specification for packaged product only. 2: measured in test mode. 3: the maximum duty-cycle is limited by the fixed mandatory off-time (t off ) of typically 300 ns.
MIC24051 ds20005658a-page 6 ? 2016 microchip technology inc. temperature specifications parameters sym. min. typ. max. units conditions temperature ranges junction operating temperature range t j ?40 ? +125 c note 1 maximum junction temperature ? ? ? +150 c ? storage temperature t s ?65 ? +150 c ? lead temperature ? ? ? +260 c soldering, 10s package thermal resistances thermal resistance, 5x6 qfn-28 ? ja ?28 ?c/w note 2 thermal resistance, 5x6 qfn-28 ? jc ?2.5 ?c/w? note 1: the maximum allowable power dissipation is a functi on of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., t a , t j , ? ja ). exceeding the maximum allowable power dissipation will cause the de vice operating junction te mperature to exceed the maximum +125c rating. sustained junction temperat ures above +125c can impa ct the device reliability. 2: p d(max) = (t j(max) ? t a )/ ? ja , where ? ja depends upon the printed circuit layout. a 5 square inch 4 layer, 0.62?, fr-4 pcb with 2 oz. finish copper weight per layer is used for the ? ja .
? 2016 microchip technology inc. ds20005658a-page 7 MIC24051 2.0 typical performance curves figure 2-1: v in operating supply current vs. input voltage. figure 2-2: v in shutdown current vs. input voltage. figure 2-3: v dd output voltage vs. input voltage. figure 2-4: feedback voltage vs. input voltage. figure 2-5: total regulation vs. input voltage. figure 2-6: output current limit vs. input voltage. note: the graphs and tables provided following this note ar e a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or t ables, the data presented may be outside the specified operating range (e.g., outside specified power suppl y range) and therefore outs ide the warranted range.
MIC24051 ds20005658a-page 8 ? 2016 microchip technology inc. figure 2-7: switching frequency vs. input voltage. figure 2-8: enable input current vs. input voltage. figure 2-9: pg threshold/v ref ratio vs. input voltage. figure 2-10: v in operating supply current vs. temperature. figure 2-11: v in shutdown current vs. temperature. figure 2-12: v dd uvlo threshold vs. temperature.
? 2016 microchip technology inc. ds20005658a-page 9 MIC24051 figure 2-13: feedback voltage vs. temperature . figure 2-14: load regulation vs. temperature . figure 2-15: line regulation vs. temperature. figure 2-16: switching frequency vs. temperature . figure 2-17: v dd vs. temperature . figure 2-18: output current limit vs. temperature .
MIC24051 ds20005658a-page 10 ? 2016 microchip technology inc. figure 2-19: switching frequency vs. output voltage. figure 2-20: feedback voltage vs. output current. figure 2-21: output voltage vs. output current. figure 2-22: line regulation vs. output current. figure 2-23: switching frequency vs. output current. figure 2-24: output voltage (v in = 5v) vs. output current.
? 2016 microchip technology inc. ds20005658a-page 11 MIC24051 figure 2-25: efficiency (v in = 5v) vs. output current. figure 2-26: ic power dissipation (v in = 5v) vs. outp ut current. figure 2-27: die temperature (v in = 5v) vs. output current ( note 1 ). figure 2-28: efficiency (v in = 12v) vs. output current. figure 2-29: ic power dissipation (v in = 12v) vs. output current. figure 2-30: die temperature (v in = 12v) vs. output current ( note 1 ).
MIC24051 ds20005658a-page 12 ? 2016 microchip technology inc. figure 2-31: thermal derating vs. ambient temperature ( note 1 ). figure 2-32: thermal derating vs. ambient temperature ( note 1 ). figure 2-33: thermal derating vs. ambient temperature ( note 1 ). figure 2-34: thermal derating vs. ambient temperature ( note 1 ). figure 2-35: v in soft turn-on. figure 2-36: v in soft turn-off. note 1: the temperature measurement was take n at the hottest point on the MIC24051 case mounted on a 5 square inch 4 layer, 0.62?, fr-4 pcb with 2oz finish coppe r weight per layer, see thermal measurement section. actual results will depend upon the size of the pcb, ambient temperature and prox imity to other heat emit- ting components. v in (10v/div) time (2ms/div) v sw (10v/div) v out (2v/div) i l (5a/div) v in = 12v, v out = 1.8v i out = 6a time (1ms/div)
? 2016 microchip technology inc. ds20005658a-page 13 MIC24051 figure 2-37: enable turn-on delay and rise time. figure 2-38: enable turn-off delay and fall time. figure 2-39: v in start-up with pre-biased output. figure 2-40: enable turn-on/turn-off. figure 2-41: enable thresholds. figure 2-42: v dd uvlo thresholds. v en (5v/div) time (2ms/div) v out (1v/div) i l (5a/div) v in = 12v v out = 1.8v i out = 6a time (2ms/div) v dd (2v/div) v out (1v/div)
MIC24051 ds20005658a-page 14 ? 2016 microchip technology inc. figure 2-43: power-up into short circuit. figure 2-44: enable into short circuit. figure 2-45: short circuit. figure 2-46: output recovery from short circuit. figure 2-47: output current-limit threshold. figure 2-48: output recovery from thermal shutdown. v in (10v/div) v out (200mv/div) i l (5a/div) time (1ms/div) v in = 12v v out = 1.8v i out = short v en (2v/div) i l (5a/div) v out (200mv/div) v in = 12v v out = 1.8v i out = 6a to short v out (1v/div) i l (5a/div) v in = 12v v out = 1.8v i out = 6a time (2ms/div) p v out (1v/div) i out (5a/div) time (40ms/div) v in = 12v v out = 1.8v v out (1v/div) v sw (10v/div) time (2.0ms/div) v in = 12v v out = 1.8v i out = 1a time (2ms/div)
? 2016 microchip technology inc. ds20005658a-page 15 MIC24051 figure 2-49: switching waveforms (i out = 6a). figure 2-50: switching waveforms (i out = 0a). figure 2-51: transient response. (ac-coupled) (ac-coupled) (ac-coupled)
MIC24051 ds20005658a-page 16 ? 2016 microchip technology inc. 3.0 pin descriptions the descriptions of the pins are listed in table 3-1 . table 3-1: pin function table pin number pin name description 1pv dd 5v internal linear regulator output. pv dd supply is the power mosfet gate drive supply voltage and created by internal ldo from v in . when v in < +5.5v, pv dd should be tied to pv in pins. a 2.2 f ceramic capacitor from the pv dd pin to pgnd (pin 2) must be place next to the ic. 2, 5, 6, 7, 8, 21 pgnd power ground. pgnd is the ground path for the MIC24051 buck converter power stage. the pgnd pins connect to the lo w-side n-channel internal mosfet gate drive supply ground, the sources of the mo sfets, the negative terminals of input capacitors, and the negative terminals of output capacitors. the loop for the power ground should be as small as possible and separate from the signal ground (sgnd) loop. 3 nc no connect. 4, 9, 10, 11, 12 sw switch node output. internal connection for the high-side mosfet source and low-side mosfet drain. due to the high-s peed switching on this pin, the sw pin should be routed away from sensitive nodes. 13,14,15, 16,17,18,19 pv in high-side n-internal mosfet drain connection input. the pv in operating voltage range is from 4.5v to 19v. input capacitors between the pv in pins and the power ground (pgnd) are required and keep the connection short. 20 bst boost output. bootstrapped voltage to t he high-side n-channel mosfet driver. a schottky diode is connected between the pv dd pin and the bst pin. a boost capacitor of 0.1 f is connected between the bst pin and the sw pin. adding a small resistor at the bst pin can slow down the turn-on time of high-side n-channel mosfets. 22 cs current sense input. the cs pin senses current by monitoring the voltage across the low-side mosfet during the off-time. the current sensing is necessary for short circuit protection. in order to sense th e current accurately, connect the low-side mosfet drain to sw using a kelvin connection. the cs pin is also the high-side mosfet?s output driver return. 23 sgnd signal ground. sgnd must be connected directly to the ground planes. do not route the sgnd pin to the pgnd pad on the top layer (see pcb layout recommendations for details). 24 fb feedback input. input to the transconductan ce amplifier of the control loop. the fb pin is regulated to 0.8v. a resistor divider connecting the feedback to the output is used to adjust the desired output voltage. 25 pg power good output. open drain output. the pg pin is externally tied with a resistor to v dd . a high output is asserted when v out > 92% of nominal. 26 en enable input. a logic level control of the output. the en pin is cmos-compatible. logic high = enable, logic low = shutdown. in the off state, supply current of the device is greatly reduced (typically 5 a). the en pin should not be left floating. 27 v in power supply voltage input. requires bypass capacitor to sgnd. 28 v dd 5v internal linear regulator output. v dd supply is the supply bus for the ic control circuit. v dd is created by internal ldo from v in . when v in < +5.5v, v dd should be tied to pv in pins. a 1 f ceramic capacitor from the v dd pin to sgnd pins must be place next to the ic.
? 2016 microchip technology inc. ds20005658a-page 17 MIC24051 4.0 functional description the MIC24051 is an adaptive on-time synchronous step-down dc/dc regulator with an internal 5v linear regulator and a power good (pg) output. it is designed to operate over a wide input voltage range from 4.5v to 19v and provides a regulated output voltage at up to 6a of output current. an adap tive on-time control scheme is employed in to obtain a constant switching frequency and to simplify the control compensation. overcurrent protection is implemented without the use of an external sense resistor. the device includes an internal soft-start function which reduces the power supply input surge current at start-up by controlling the output voltage rise time. 4.1 theory of operation the MIC24051 operates in a continuous mode as shown in the block diagram . 4.2 continuous mode in continuous mode, the out put voltage is sensed by the MIC24051 feedback pin fb via the voltage divider r1 and r2, and compared to a 0.8v reference voltage v ref at the error comparator through a low gain transconductance (g m ) amplifier. if the feedback voltage decreases and the output of the g m amplifier is below 0.8v, then the error comparator will trigger the control logic and generate an on-time period. the on-time period length is predetermined by the ?fixed t on estimation? circuitry: equation 4-1: at the end of the on-time period, the internal high-side driver turns off the high-side mosfet and the low-side driver turns on the low-side mosfet. the off-time period length depends upon the feedback voltage in most cases. when the fe edback voltage decreases and the output of the gm am plifier is below 0.8v, the on-time period is triggered and the off-time period ends. if the off-time period determined by the feedback voltage is less than the minimum off-time t off(min) , which is about 300 ns, the MIC24051 control logic will apply the t off(min) instead. t off(min) is required to maintain enough energy in the boost capacitor (c bst ) to drive the high-side mosfet. the maximum duty cycle is obtained from the 300 ns t off(min) : equation 4-2: it is not recommended to use MIC24051 with a off-time close to t off(min) during steady-state operation. also, as v out increases, the internal ripple injection will increase and reduce the line regulation performance. therefore, the maximum output voltage of the MIC24051 should be limited to 5.5v and the maximum external ripple in jection should be limited to 200 mv. please refer to setting output voltage in the application information section for more details. the actual on-time and resulting switching frequency will vary with the part-to-part variation in the rise and fall times of the internal mosfets, the output load current, and variations in the v dd voltage. also, the minimum t on results in a lower switching frequency in high v in to v out applications, such as 18v to 1.0v. the minimum t on measured on the MIC24051 evaluation board is about 100 ns. during load transients, the switching frequency is changed due to the varying off-time. to illustrate the control loop operation, we will analyze both the steady-state and load transient scenarios. figure 4-1 shows the MIC24051 control loop timing during steady-state operation. during steady-state, the gm amplifier senses the feedback voltage ripple, which is proportional to the output voltage ripple and the inductor current ripple, to trigger the on-time period. the on-time is predetermined by the t on estimator. the termination of the off-time is controlled by the feedback voltage. at the valley of the feedback voltage ripple, which occurs when v fb falls below v ref , the off period ends and the next on-time period is triggered through the control logic circuitry. t on estimated ?? v out v in 600 khz ? ---------------------------------- = where: v out output voltage v in power stage input voltage d max t s t off min ?? ? t s ---------------------------------- -1 300 ns t s -------------- - ? == where: t s 1/600 khz = 1.66 s
MIC24051 ds20005658a-page 18 ? 2016 microchip technology inc. figure 4-1: MIC24051 control loop timing. figure 4-2 shows the operation of the MIC24051 during a load transient. the output voltage drops due to the sudden load increase, which causes the v fb to be less than v ref . this will cause the error comparator to trigger an on-time period. at the end of the on-time period, a minimum off-time t off(min) is generated to charge c bst because the feedback voltage is still below v ref . then, the next on-time period is triggered due to the low feedback voltage. therefore, the switching frequency changes during the load transient, but returns to the nominal fixed frequency once the output has stabilized at the new load current level. with the varying duty cycle and switching frequency, the output recovery time is fast and the output voltage deviation is small in MIC24051 converter. figure 4-2: MIC24051 load transient response. unlike true current-mode control, the MIC24051 uses the output voltage ripple to trigger an on-time period. the output voltage ripple is proportional to the inductor current ripple if the esr of the output capacitor is large enough. the MIC24051 control loop has the advantage of eliminating the need for slope compensation. in order to meet the stability requirements, the MIC24051 feedback voltage ripple should be in phase with the inductor current ripple and large enough to be sensed by the gm amplifier and the error comparator. the recommended feedback voltage ripple is 20 mv~100 mv. if a low-esr output capacitor is selected, then the feedback voltage ripple may be too small to be sensed by the gm amplifier and the error comparator. also, the output voltage ripple and the feedback voltage ripple are not necessarily in phase with the inductor current ri pple if the esr of the output capacitor is very low. in th ese cases, ripple injection is required to ensure proper operation. please refer to ripple injection in the application information section for more details about the ripple injection technique. 4.3 v dd regulator the MIC24051 provides a 5v regulated output for input voltage v in ranging from 5.5v to 19v. when v in < 5.5v, v dd should be tied to pv in pins to bypass the internal linear regulator. 4.4 soft-start soft-start reduces the power supply input surge current at startup by controlling the output voltage rise time. the input surge appears while the output capacitor is charged up. a slower output rise time will draw a lower input surge current. the MIC24051 implements an internal digital soft-start by making the 0.8v reference voltage v ref ramp from 0 to 100% in about 3 ms wi th 9.7 mv steps. therefore, the output voltage is contro lled to increase slowly by a stair-case v fb ramp. once the soft-start cycle ends, the related circuitry is disabled to reduce current consumption. v dd must be powered up at the same time or after v in to make the soft-start function correctly. 4.5 current limit the MIC24051 uses the r ds(on) of the internal low-side power mosfet to sense over-current conditions. this method will avoid adding cost, board space and power losses taken by a discrete current sense resistor. the low-side mosfet is used because it displays much lower para sitic oscillations during switching than the high-side mosfet. in each switching cycle of t he MIC24051 converter, the inductor current is sensed by monitoring the low-side mosfet in the off period. if the peak inductor current is greater than 11a, then the MIC24051 turns off the high-side mosfet and a soft-start sequence is triggered. this mode of operation is called ?hiccup mode? and its purpose is to protect the downstream load in case of a hard short. the load current-limit threshold has a fold-back characteristic related to the feedback voltage as shown in figure 4-3 .
? 2016 microchip technology inc. ds20005658a-page 19 MIC24051 figure 4-3: MIC24051 current-limit foldback characteristic. 4.6 power good (pg) the power good (pg) pin is an open drain output which indicates logic high when the output is nominally 92% of its steady state volt age. a pull-up resistor of more than 10 k ? should be connected from pg to v dd . 4.7 mosfet gate drive the block diagram shows a bootstrap circuit, consisting of d1 (a schottky diode is recommended) and c bst . this circuit supplies energy to the high-side drive circuit. capacitor c bst is charged, while the low-side mosfet is on, and the voltage on the sw pin is approximately 0v. when the high-side mosfet driver is turned on, energy from c bst is used to turn the mosfet on. as the high-side mosfet turns on, the voltage on the sw pin increases to approximately v in . diode d1 is reverse biased and c bst floats high while continuing to keep the high-side mosfet on. the bias current of the high-side driver is less than 10 ma, so a 0.1 f to 1 f is sufficient to hold the gate voltage with minimal droop for the power stroke (high-side switching) cycle, i.e. ? bst = 10 ma x 1.67 s/0.1 f = 167 mv. when the low-side mosfet is turned back on, c bst is recharged through d1. a small resistor r g , which is in series with c bst , can be used to slow down the turn-on time of the high-side n-channel mosfet. the drive voltage is derived from the v dd supply voltage. the nominal low-side gate drive voltage is v dd and the nominal high-side gate drive voltage is approximately v dd ? v diode , where v diode is the voltage drop across d1. an approximate 30 ns delay between the high-side and low-side driver transitions is used to prevent current from simultaneously flowing unimpeded through both mosfets.
MIC24051 ds20005658a-page 20 ? 2016 microchip technology inc. 5.0 application information 5.1 inductor selection values for inductance, peak, and rms currents are required to select the output inductor. the input and output voltages and the inductance value determine the peak-to-peak inductor ripple current. generally, higher inductance values are used with higher input voltages. larger peak-to-peak ripple currents will increase the power dissipation in the inductor and mosfets. larger output ripple currents will also require more output capacitance to smooth out the larger ripple current. smaller peak-to-peak ripple currents require a larger inductance value and therefore a larger and more expensive inductor. a good compromise between size, loss and cost is to set the inductor ripple current to be equal to 20% of the maximum output current. the inductance value is calculated in equation 5-1 . equation 5-1: the peak-to-peak induct or current ripple is: equation 5-2: the peak inductor current is equal to the average output current plus one ha lf of the peak-to-peak inductor current ripple. equation 5-3: the rms inductor current is used to calculate the i 2 r losses in the inductor. equation 5-4: maximizing efficiency requires the proper selection of core material and minimizing the winding resistance. the high-frequency operation of the MIC24051 requires the use of ferrite materials for all but the most cost sensitive applications . lower cost iron powder cores may be used but the increase in core loss will reduce the efficiency of the power supply. this is especially noticeable at low output power. the winding resistance decreases efficiency at the higher output current levels. the winding resistance must be minimized although this usual ly comes at the expense of a larger inductor. the power dissipated in the inductor is equal to the sum of the core and copper losses. at higher output loads, the core losses are usually insignificant and ca n be ignored. at lower output currents, the core losses can be a significant contributor. core loss information is usually available from the magnetics vendor. copper loss in the inductor is calculated by equation 5-5 : equation 5-5: the resistance of the copper wire, r winding , increases with the temperature. th e value of the winding resistance used should be at the operating temperature. equation 5-6: l v out v in max ?? v out ? ?? ? v in max ?? f sw ? 20% ? i out max ?? ? ---------------------------------------------------------------------------------------- = where: f sw switching frequency, 600 khz 20% ratio of ac ripple current to dc output current v in(max) maximum power stage input voltage i lpp ?? ? v out v in max ?? v out ? ?? ? v in max ?? f sw ? l ? ------------------------------------------------------------------- - = i lpk ?? i out max ?? 0.5 + i lpp ?? ? ? = i lrms ?? i out max ?? 2 i lpp ?? 2 ? 12 -------------------- - + = p inductor cu ?? i lrms ?? 2 r winding ? = r winding ht ?? r winding 20 c ?? 1 0.0042 t h t 20 c ? ?? ? + ?? ? = where: t h temperature of wire under full load t 20c ambient temperature r winding(20c) room temperature winding resistance (usually specified by the manufacturer)
? 2016 microchip technology inc. ds20005658a-page 21 MIC24051 5.2 output capacitor selection the type of the output capacitor is usually determined by its equivalent series resistance (esr). voltage and rms current capability are two other important factors for selecting the output capacitor. recommended capacitor types are ceramic, low-esr aluminum electrolytic, os-con and poscap. the output capacitor?s esr is usually the main cause of the output ripple. the output capaci tor esr also affects the control loop from a stability point of view. the maximum value of esr is calculated: equation 5-7: the total output ripple is a combination of the esr and output capacitance. the total ripple is calculated in equation 5-8 : equation 5-8: as described in the theory of operation section, the MIC24051 requires at least 20 mv peak-to-peak ripple at the fb pin to make the g m amplifier and the error comparator behave properly . also, the output voltage ripple should be in phase with the inductor current. therefore, the output volt age ripple caused by the output capacitors value should be much smaller than the ripple caused by the output capacitor esr. if low-esr capacitors, such as ceramic capacitors, are selected as the output capacitors, a ripple injection method should be applied to provide the enough feedback voltage ripple. please refer to the ripple injection section for more details. the voltage rating of the capacitor should be twice the output voltage for a tantalum and 20% greater for aluminum electrolytic or os-con. the output capacitor rms current is calculated in equation 5-9 : equation 5-9: the power dissipated in the output capacitor is: equation 5-10: 5.3 input capacitor selection the input capacitor for the power stage input v in should be selected for ripple current rating and voltage rating. tantalum input capacitors may fail when subjected to high inrush currents, caused by turning the input supply on. a tantalum input capacitor?s voltage rating should be at least two times the maximum input voltage to maximize reliability. aluminum electrolytic, os-con, and multilayer polymer film capacitors can handle the higher inrush currents without voltage de-rating. the input voltage ripple will primarily depend on the input capacitor?s esr. the peak input current is equal to the peak inductor current, so: equation 5-11: the input capacitor must be rated for the input current ripple. the rms value of input capacitor current is determined at the maximum output current. assuming the peak-to-peak inductor current ripple is low: equation 5-12: esr cout v out pp ?? ? i lpp ?? ? --------------------------- ? where: ? v out(pp) peak-to-peak output voltage ripple ? i l(pp) peak-to-peak inductor current ripple v out pp ?? ? i lpp ?? ? c out f sw ? 8 ? ------------------------------------- - ?? ?? 2 i lpp ?? ? esr cout ? ?? 2 + = where: c out output capacitance value f sw switching frequency i cout rms ?? i lpp ?? ? 12 ------------------ = p diss cout ?? i cout rms ?? esr cout ? = v in ? i lpk ?? esr cin ? = i cin rms ?? i out max ?? d 1 d ? ?? ? ? ?
MIC24051 ds20005658a-page 22 ? 2016 microchip technology inc. the power dissipated in the input capacitor is: equation 5-13: 5.4 ripple injection the v fb ripple required for proper operation of the MIC24051 g m amplifier and error comparator is 20 mv to 100 mv. however, the output voltage ripple is generally designed as 1% to 2% of the output voltage. for a low output voltage, such as a 1v, the output voltage ripple is only 10 mv to 20 mv, and the feedback voltage ripple is less than 20 mv. if the feedback voltage ripple is so small that the g m amplifier and error comparator can?t sense it, then the MIC24051 will lose control and the output voltage is not regulated. in order to have some amount of v fb ripple, a ripple injection method is applied for low output voltage ripple applications. the applications are divided into three situations according to the amount of the feedback voltage ripple: 1. enough ripple at the feedback voltage due to the large esr of the output capacitors. figure 5-1: enough ripple at fb. as shown in figure 5-1 , the converter is stable without any ripple injection. the feedback voltage ripple is: equation 5-14: 2. inadequate ripple at the feedback voltage due to the small esr of the output capacitors. figure 5-2: inadequate ripple at fb. the output voltage ripple is fed into the fb pin through a feed-forward capacitor c ff in this situation, as shown in figure 5-2 . the typical c ff value is between 1 nf and 100 nf. with the feed-forward capacitor, the feedback voltage ripple is very close to the output voltage ripple: equation 5-15: 3. virtually no ripple at the fb pin voltage due to the very low esr of the output capacitors. figure 5-3: invisible ripple at fb. in this situation, the output voltage ripple is less than 20 mv. therefore, additional ripple is injected into the fb pin from the switching node sw via a resistor r inj and a capacitor c inj , as shown in figure 5-3 . the injected ripple is: equation 5-16: p diss cin ?? i cin rms ?? esr cin ? = MIC24051 sw fb l r1 r2 c out esr v fb pp ?? ? r 2 r 1 r 2 + ------------------- - esr cout ? i lpp ?? ? ? = where: ? i l(pp) peak-to-peak value of the inductor current ripple MIC24051 sw fb l r1 r2 c out esr c ff v fb pp ?? ? esr i lpp ?? ? ? ? MIC24051 sw fb l r1 r2 c out esr c ff r inj c inj v fb pp ?? ? v in k div ? d ? 1 d ? ?? ? 1 f sw ? ? ---------------- - ? = where: v in power stage input voltage d duty cycle f sw switching frequency (r1//r2//r inj ) c ff
? 2016 microchip technology inc. ds20005658a-page 23 MIC24051 equation 5-17: in equation 5-16 and equation 5-17 , it is assumed that the time constant associated with c ff must be much greater than the switching period: equation 5-18: if the voltage divider resistors r1 and r2 are in the k ? range, a c ff of 1 nf to 100 nf can easily satisfy the large time constant requirements. also, a 100 nf injection capacitor c inj is used in order to be considered as short for a wide range of the frequencies. the process of sizing the ripple injection resistor and capacitors is: 1. select c ff to feed all output ripples into the feed- back pin and make sure the large time constant assumption is satisfied. typical choice of c ff is 1 nf to 100 nf if r1 and r2 are in k ? range. 2. select r inj according to the expected feedback voltage ripple using equation 5-19 . equation 5-19: then the value of r inj is obtained as: equation 5-20: 3. select c inj as 100 nf, which could be consid- ered as short for a wide range of the frequen- cies. 5.5 setting output voltage the MIC24051 requires two resistors to set the output voltage as shown in figure 5-4 . the output voltage is determined by equation 5-21 : equation 5-21: v fb equals 0.8v. a typical value of r1 can be between 3k ? and 10 k ? . if r1 is too large, it may allow noise to be introduced into the voltage feedback loop. if r1 is too small, it will decrease the efficiency of the power supply, especially at light loads. once r1 is selected, r2 can be calculated using: equation 5-22: figure 5-4: voltage divider configuration. in addition to the external ripple injection added at the fb pin, internal ripple injection is added at the inverting input of the comparator in side the MIC24051, as shown in figure 5-5 . the inverting input voltage v inj is clamped to 1.2v. as v out is increased, the swing of v inj will be clamped. the clamped v inj reduces the line regulation because it is reflected as a dc error on the fb terminal. theref ore, the maximum output voltage of the MIC24051 shoul d be limited to 5.5v to avoid this problem. k div r 1//r2 r inj r 1//r2 + ---------------------------------- - = 1 f sw ? ? ---------------- - t ? -- -1 ? = k div v fb pp ?? ? v in ----------------------- f sw ? ? d 1 d ? ?? ? ---------------------------- ? = r inj r 1//r2 ?? 1 k div ------------ 1 ? ?? ?? ? = v out v fb 1 r 1 r 2 ------ - + ?? ?? ? = r 2 v fb r 1 ? v out v fb ? ----------------------------- =
MIC24051 ds20005658a-page 24 ? 2016 microchip technology inc. figure 5-5: internal ripple injection. 5.6 thermal measurements measuring the ic?s case temperature is recommended to ensure it is within its operating limits. although this might seem like a very elementary task, it is easy to get erroneous results. the most common mistake is to use the standard thermal couple that comes with a thermal meter. this thermal couple wire gauge is large, typically 22 gauge, and behaves like a heatsink, resulting in a lower case measurement. two methods of temperatur e measurement are using a smaller thermal couple wire or an infrared thermometer. if a thermal couple wire is used, it must be constructed of 36 gauge wire or higher then (smaller wire size) to minimize the wire heat-sinking effect. in addition, the thermal couple tip must be covered in either thermal grease or thermal glue to make sure that the thermal couple junction is making good contact with the case of the ic. omega brand thermal couple (5sc-tt-k-36-36) is adequate for most applications. wherever possible, an infrared thermometer is recommended. the measurem ent spot size of most infrared thermometers is too large for an accurate reading on a small form factor ics. however, an ir thermometer from optris ha s a 1 mm spot size, which makes it a good choice for measuring the hottest point on the case. an optional stand makes it easy to hold the beam on the ic for long periods of time.
? 2016 microchip technology inc. ds20005658a-page 25 MIC24051 6.0 pcb layout recommendations to minimize emi and output noise, follow these layout recommendations. pcb layout is critical to achieve reliable, stable and efficient performance. a ground plane is required to control emi and minimize the inductance in power, signal and return paths. the following guidelines should be followed to insure proper operation of the MIC24051 regulator. 6.1 ic ? a 2.2 f ceramic capacitor, which is connected to the pv dd pin, must be located right at the ic. the pv dd pin is very noise sensitive and placement of the capacitor is very critical. use wide traces to connect to the pv dd and pgnd pins. ? a 1 f ceramic capacitor must be placed right between v dd and the signal ground sgnd. the sgnd must be connected directly to the ground planes. do not route the sgnd pin to the pgnd pad on the top layer. ? place the ic close to the point-of-load (pol). ? use fat traces to route the input and output power lines. ? signal and power grounds should be kept separate and connected at only one location. 6.2 input capacitor ? place the input capacitors on the same side of the board and as close to the ic as possible. ? keep both the pv in pin and pgnd connections short. ? place several vias to the ground plane close to the input capacitor ground terminal. ? use either x7r or x5r dielectric input capacitors. do not use y5v or z5u type capacitors. ? do not replace the ceramic input capacitor with any other type of capacitor. any type of capacitor can be placed in parallel with the input capacitor. ? if a tantalum input capacitor is placed in parallel with the input capacitor, it must be recommended for switching regulator applications and the operating voltage must be derated by 50%. ? in ?hot-plug? applications, a tantalum or electrolytic bypass capacito r must be used to limit the over-voltage spike seen on the input supply with power is suddenly applied. 6.3 inductor ? keep the inductor connection to the switch node (sw) short. ? do not route any digital lines underneath or close to the inductor. ? keep the switch node (sw) away from the feedback (fb) pin. ? the cs pin should be connected directly to the sw pin to accurate sense the voltage across the low-side mosfet. ? to minimize noise, place a ground plane underneath the inductor. ? the inductor can be placed on the opposite side of the pcb with respect to the ic. it does not matter whether the ic or inductor is on the top or bottom as long as there is enough air flow to keep the power components within their temperature limits. the input and outpu t capacitors must be placed on the same side of the board as the ic. 6.4 output capacitor ? use a wide trace to connect the output capacitor ground terminal to the input capacitor ground terminal. ? phase margin will change as the output capacitor value and esr changes. contact the factory if the output capacitor is different from what is shown in the user guide. ? the feedback trace should be separate from the power trace and connected as close as possible to the output capacitor. sensing a long high-current load trace can degrade the dc load regulation. 6.5 optional rc snubber ? place the rc snubber on either side of the board and as close to the sw pin as possible.
MIC24051 ds20005658a-page 26 ? 2016 microchip technology inc. 7.0 packaging information 7.1 package marking information 28-pin qfn* example xxx wnnn xxxxxxxx mic 6420 24051yjl legend xx...x product code or cust omer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec ? designator for matte tin (sn) * this package is pb-free. the pb -free jedec designator ( ) can be found on the outer packaging for this package. , , pin one index is identified by a dot, delta up, or delta down (triangle mark). note : in the event the full microchip part numbe r cannot be marked on one line, it will be carried over to the next line, t hus limiting the number of available characters for customer-specific informa tion. package may or may not include the corporate logo. underbar (_) and/or overbar ( ? ) symbol may not be to scale. 3 e 3 e
? 2016 microchip technology inc. ds20005658a-page 27 MIC24051 28-pin 5 mm x 6 mm qfn package outline and recommended land pattern note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging.
MIC24051 ds20005658a-page 28 ? 2016 microchip technology inc.
? 2016 microchip technology inc. ds20005658a-page 29 MIC24051 appendix a: revision history revision a (november 2016) ? converted micrel docu ment MIC24051 to micro- chip data sheet ds20005658a. ? minor text changes throughout. ? vertical axis description updated in figure 2-9 . ? labeling of figure 2-42 corrected v in to v dd . ? corrected a naming error in equation 5-6 . ? corrected a formatting error in equation 5-17 .
MIC24051 ds20005658a-page 30 ? 2016 microchip technology inc. notes:
? 2016 microchip technology inc. ds20005658a-page 31 MIC24051 product identification system to order or obtain information, e.g., on pricing or delivery, contact your local microchip representative or sales office . examples: a) MIC24051yjl-tr: 12v, 6a high-efficiency buck regulator with hyper speed control, ?40c to +125c temperature range, 28-lead qfn, 1,000/reel part no. x x package device device: MIC24051: 12v, 6a high-efficiency buck regulator with hyper speed control temperature: y = ?40c to +125c (industrial) package: jl = 28-lead 5 mm x 6 mm qfn media type: tr = 1,000/reel x temperature x.x ? media type note 1: tape and reel identifier only appears in the catalog part number description. this identifier is used for ordering purposes and is not printed on the device package. chec k with your microchip sales office for package availability with the tape and reel option.
MIC24051 ds20005658a-page 32 ? 2016 microchip technology inc. notes:
? 2016 microchip technology inc. ds20005658a-page 33 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting fr om such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights unless otherwise stated. trademarks the microchip name and logo, the microchip logo, anyrate, dspic, flashflex, flexpwr, heldo, jukeblox, keeloq, keeloq logo, kleer, lancheck, link md, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. clockworks, the embedded control solutions company, ethersynch, hyper speed control, hyperlight load, intellimos, mtouch, precision edge, and quiet-wire are registered trademarks of microc hip technology incorporated in the u.s.a. analog-for-the-digital age, any capacitor, anyin, anyout, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dynamic average matching, dam, ecan, ethergreen, in-circuit serial programming, icsp, inter-chip connectivity, jitterblocker, kleernet, kleernet logo, miwi, motorbench, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem.net, pickit, pictail, puresilicon, righttouch logo, real ice, ripple blocker, serial quad i/o, sqi, superswitcher, superswitcher ii, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. gestic is a registered tradem arks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2016, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn: 978-1-5224-1076-8 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip pr oducts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microper ipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem by dnv == iso/ts 16949 ==
ds20005658a-page 34 ? 2016 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 austin, tx tel: 512-257-3370 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit novi, mi tel: 248-848-4000 houston, tx tel: 281-894-5983 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 tel: 317-536-2380 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 tel: 951-273-7800 raleigh, nc tel: 919-844-7510 new york, ny tel: 631-435-6000 san jose, ca tel: 408-735-9110 tel: 408-436-4270 canada - toronto tel: 905-695-1980 fax: 905-695-2078 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2943-5100 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - dongguan tel: 86-769-8702-9880 china - guangzhou tel: 86-20-8755-8029 china - hangzhou tel: 86-571-8792-8115 fax: 86-571-8792-8116 china - hong kong sar tel: 852-2943-5100 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-3326-8000 fax: 86-21-3326-8021 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8864-2200 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 asia/pacific china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-3019-1500 japan - osaka tel: 81-6-6152-7160 fax: 81-6-6152-9310 japan - tokyo tel: 81-3-6880- 3770 fax: 81-3-6880-3771 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-213-7830 taiwan - taipei tel: 886-2-2508-8600 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 finland - espoo tel: 358-9-4520-820 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 france - saint cloud tel: 33-1-30-60-70-00 germany - garching tel: 49-8931-9700 germany - haan tel: 49-2129-3766400 germany - heilbronn tel: 49-7131-67-3636 germany - karlsruhe tel: 49-721-625370 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 germany - rosenheim tel: 49-8031-354-560 israel - ra?anana tel: 972-9-744-7705 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 italy - padova tel: 39-049-7625286 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 norway - trondheim tel: 47-7289-7561 poland - warsaw tel: 48-22-3325737 romania - bucharest tel: 40-21-407-87-50 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 sweden - gothenberg tel: 46-31-704-60-40 sweden - stockholm tel: 46-8-5090-4654 uk - wokingham tel: 44-118-921-5800 fax: 44-118-921-5820 worldwide sales and service 11/07/16

▲Up To Search▲

Price & Availability of MIC24051

	To Download MIC24051 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .